JINPENG Manufacturing Capacity 2021 | 金鹏电子制程能力2021 |
Comprehensive monthly capacity : 250,000㎡ | 综合月产能：25万㎡ |
LAYER: ≤12 | 层数：≤12层 |
Product type: FR-4 (high Tg, high CTI, halogen-free, impedance plate, BGA plate, thick copper plate (6oz), buried blind hole plate, PTH half hole plate), CEM-1, CEM-3, aluminum substrate, mini & micro LED | 产品类型：FR-4（高TG、高CTI、无卤素、阻抗板、BGA板、厚铜板（6oz）、埋盲孔板、PTH半孔板）、CEM-1、CEM-3、铝基板、mini & micro LED类 |
Board Material | 原材料 |
Base Material:KB/ SYTECH Aluminum substrate: CSEM / WAZAM | 常规板材：建滔/生益 铝基板：清晰/华正 |
Printing ink:TAIYO/Eternal/ABQ/Sekisui | 油墨：太阳、长兴、板桥、积水 |
Surface Finishing | 表面处理 |
HASL,HASL Leadfree,ENIG(ImmersionGold),OSP(Entek), | 铅锡，纯锡，化金，OSP，化锡，化银，镀硬金 |
Selective Surface Finishing | 选择性表面处理 |
ENIG(Immersion Gold)+OSP,ENIG+Gold Finger,Immersion Silver+Glod Finger,Immersion Tin+Gold Finger | 化金+OSP，化金+金手指，化银+金手指，化锡+金手指 |
Technical Specification | 技术参数 |
Min Line Width:4/4mil | 最小线宽：4/4mil |
Min Hole Size:0.25mm(Mechanical Drill) | 最小孔径：0.25mm(机械钻孔) |
Min Annular Ring:5mil | 最小焊环：5mil |
Max Copper Thickness:60Z(Outer Layer) | 最厚铜厚：60Z（外层） |
Max Panel Size:540mm*650mm | 最大成品尺寸：540mm*650mm |
Board Thickness:0.4nn-3.0mm | 板厚：0.4mm-3.0mm |
Min Solder Mask Bridge≧0.08mm | 阻焊桥：≧0.08mm |
Aspect ratio:7:1 | 板厚孔径比（纵横比）：7:1 |
Pluggine Vias Capabioity:0.2-0.6mm | 塞孔能力：0.2-0.6mm |
Impedance Control:10% | 阻抗控能:±10% |
Tolerance | 公差 |
Plated Holes Tolerance:±0.08mm(min±0.05) | 金属化孔：±0.08mm（极限±0.05） |
Non-Plated Hole Tolerance: ±0.05mm(min+0/-0.075mm or+0.075/-0mm) | 非金属化孔：±0.05mm(极限+0/-0.075mm or+0.075/-0mm) |
Outline Tolerance:±0.15mm(min±0.10mm) | 外形公差：±0.15mm(极限±0.10mm) |
Functional Test | 功能测试 |
Insulating Resisitance:50ohms(normality) | 绝缘电阻：50ohms（常态） |
Peel Off Strength:1.4N/mm | 可剥离强度：1.4N/mm |
Thermal Stress Test:260 degree,20seconds | 热冲击测试：260℃,20秒 |
Soder Mask Hardness:≧6H | 阻焊剂硬度：≧6H |